Gradiant wins water contracts for US semiconductor fabs

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Water and wastewater treatment company Gradiant says it has secured US$300 million in new contracts from semiconductor manufacturing customers since the start of 2026, spanning fabrication sites in New York, Virginia, Idaho and Utah.

The company said the projects include ultrapure water production, high-recovery wastewater treatment, local scrubber reclaim and zero liquid discharge systems. Gradiant said the work is intended to reduce freshwater demand and increase water reuse in locations facing tighter water constraints.

Gradiant said it will deliver a mix of services across the sites, including treatment of complex waste streams such as hydrofluoric-acid wastewater. The company said several awards are repeat contracts, including a second phase of a high-recovery wastewater facility at a large semiconductor fabrication plant and a scrubber reclaim design that it said recovers more than 80 per cent of feed volume.

In a statement, Gradiant CEO Prakash Govindan linked the contracts to increasing demand for chips used in AI data centres, describing water availability as a factor influencing how quickly new capacity can be built. Managing Director for the Americas Nish Vora said the contract wins support the company’s target of a US$1 billion US order book next year.

The announcement comes as semiconductor manufacturers continue to invest in new fabrication capacity, including for high-bandwidth memory and other components used in AI infrastructure. The associated demand for reliable, high-quality water supply and wastewater treatment has become a planning consideration for new and expanding fabs, particularly in regions where water scarcity and regulatory constraints can affect project timelines.

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