Semiconductor company RRP Electronics Limited has signed a memorandum of understanding with Taiwan’s AMB, Taiwan. The agreement will spearhead the production of advanced Memory Modules including SPI NAND, MICROSD, EMMC, and SSD technologies. The partnership is also projected to generate USD25 million in annual revenue and marks a significant milestone in the global semiconductor ecosystem.
The agreement encompasses comprehensive technology sharing, including package structure details, substrate designs, test program development, and tool design support. With extended capacities starting from 2GB onwards, the new memory solutions will cater to increasing demand in the global electronics market.
“RRP Electronics is thrilled to partner with AMB, Taiwan,” said RRP Electronics Chairman Rajendra Chodankar. “Through this association, we will deploy cutting-edge technology at our state-of-the-art facility, ensuring our products are ready to serve leading corporate giants like Samsung and other major players.”
The production will take place at RRP Electronics’ 40,000 square foot outsourced semiconductor assembly and test factory located in the Indian city of Mahape, which became operational in September 2024.
To meet growing demand, the company is also expanding its manufacturing footprint with new production lines at its upcoming plant at Taloja, which is expected to commence operations within the next two years.
