HyperLight Corporation said VentureTech Alliance (VTA) has joined its Series C financing round, expanding the investor group backing the company’s thin-film lithium niobate (TFLN) photonics technology.
In a statement issued via Business Wire, HyperLight described VTA as a semiconductor-focused venture investment firm with holdings spanning circuit design, foundry-adjacent process technology, electronic design automation, advanced packaging and photonics.
HyperLight said the Series C syndicate includes investors across silicon ICs, foundry manufacturing, electronics manufacturing services, networking and infrastructure capital, and that VTA’s participation extends the group further into semiconductor manufacturing and design-enablement.
“The transition to TFLN is not a component decision — it is an ecosystem decision,” said Mian Zhang, CEO of HyperLight, referencing the need for process development, design rules, models and qualification data to support high-volume production.
The company said its TFLN Chiplet Platform is intended to support multiple optical interconnect use cases, including short-reach IMDD data center pluggables, longer-reach coherent datacom and telecom modules, and co-packaged optics. HyperLight said products supporting 200G-per-lane operation are in production, with 400G-per-lane solutions sampling.
HyperLight also said its TFLN engines are designed to be adopted as integration-ready IP blocks within partners’ advanced packaging and co-packaged optics flows, supported by design rules, device models and reliability data. The company said it holds more than 150 patents covering TFLN device architecture, high-speed electrode design and manufacturing processes.
VentureTech Alliance managing partner Kai Tsang said in the release that TFLN’s bandwidth and power efficiency are relevant to “next-generation AI interconnect.”
The announcement comes as data centre and telecom operators look for higher-capacity, lower-power optical interconnect technologies, with semiconductor manufacturing readiness and ecosystem support seen as key constraints on scaling new photonics platforms into high-volume deployments.
